Current informations

Notices regarding 


Meetings / Conferences / Workshops 


related to piezo technology are given here ...



Design Thinking Workshop in der HPI D-School in Potsdam


Zahngesundheit: Belastungskontrolle der Zähne, kontrolliertes und stimuliertes Einwachsen von Zahnimplantaten


Ziel ist es, die im ersten Workshop entwickelten Ideen für eine Kontrolle der Zahnbelastung und für eine komplikationslose und effektive Zahnimplantation weiterzuverfolgen und sie co-kreativ in Richtung konkret umsetzbarer Produktentwicklungen zuzuspitzen.

Formlose Anmeldung per Mail unter: Bitte beachten Sie: Die Teilnehmerzahl ist begrenzt. Sie erhalten eine Anmeldebestätigung.


Terminplanung Folgeworkshop: 26.07.2019

ISPA 2019 & MEGGIT workshop: "Piezoelectric materials and applications"  October 9th to 11th, Dresden, Germany

The International Symposium on Piezocomposite Applications, ISPA 2019 will take place October 9-11, 2019 at Dresden, Germany. Please mark your calendar!

Call for Papers

You like to present your recent research developments? Submit an abstract to no later than April 29, 2019.


More details see:

IEEE IUS 2019,  October 6th to 9th, 2019, Glasgow, Scotland

The 2019 IEEE International Ultrasonics Symposium will take place from October 6th to 9th in Glasgow, Scotland. Glasgow is a highly appropriate host for IEEE IUS 2019 and abstracts are now sought, describing original research in the field of ultrasonics and closely related topics, for presentation in oral or poster format.


Further details see:

ISAF-ICE-EMF-IWPM-PFM Joint Conference, July 14-19, 2019, Lausanne, Switzerland

The conference will be held at the Swiss Tech Convention Center at EPFL, Lausanne, Switzerland from July 14 to 19, 2019. It aims to bring together leaders from academia, national laboratories and industrial research and development sectors, to discuss the most recent advancements in the science and technology of ferroelectric, electroceramic, and dielectric materials, covering a broad range of fields from theory and modeling of the materials, via processing and characterization thereof, to the development of new applications and devices.

Abstract deadline: February 4, 2019


More details see: